PCB Fab Capabilities

Standard process capabilities for boards fabricated by ProEmbSys Technologies. If your design falls outside these specs, contact us before ordering — some advanced specs are available on request.

General

Layer count1–8 layers
Max board size (single piece)500mm × 500mm
Board thickness0.4mm – 3.2mm
Board outline tolerance±0.15mm

Copper & Traces

Min track width / spacing0.1mm (4 mil)(advanced: 0.09mm (3.5 mil))
Copper weight (outer layers)1 oz – 3 oz
Impedance control tolerance±10%

Drilling

Min mechanical drill size0.3mm(advanced: 0.2mm)
Min annular ring0.15mm(advanced: 0.13mm)
Hole position tolerance±0.075mm
Max aspect ratio (board thickness : drill dia.)10:1

Solder Mask & Silkscreen

Min solder mask clearance0.05mm
Min silkscreen line width0.15mm
Min silkscreen text height0.8mm

Surface Finish

Available finishesHASL (Lead-free), ENIG, OSP, Immersion Silver, Hard Gold

Panelization

V-scoringSupported, straight cuts only
Tab routing / mousebitesSupported
Fiducials & tooling holesSupported, customer-configurable